BYD47-20 Fast Soft-recovery Rectifier

BYD47-20 Fast soft-recovery Rectifier Cavity free cylindrical glass SOD87 package through Implotec technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
By NXP Semiconductors
Part Manufacturer Description Datasheet Samples
RI-TRP-R9QL-20 Texas Instruments 30MM DISK TRANSPONDER 1-RFIDP -25 TO 85
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PC-SOIC/DIP20-04 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO20A_SO20B_SO20D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 20; Bottom Pin Count: 20; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.275 - 0.475; Adapter Size Length X Width (in.): 1 x 0.4; Part Description: SOIC to DIP Converter;
LTC6421IUDC-20#TR Linear Technology LTC6421-20 - Dual Matched 1.3GHz Differential Amplifiers/ADC Drivers; Package: QFN; Pins: 20; Temperature: Industrial
LTC6421IUDC-20 Linear Technology LTC6421-20 - Dual Matched 1.3GHz Differential Amplifiers/ADC Drivers; Package: QFN; Pins: 20; Temperature: Industrial
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LTC6420IUDC-20#TR Linear Technology LTC6420-20 - Dual Matched 1.8GHz Differential Amplifiers/ADC Drivers; Package: QFN; Pins: 20; Temperature: Industrial
LTC6420CUDC-20#TR Linear Technology LTC6420-20 - Dual Matched 1.8GHz Differential Amplifiers/ADC Drivers; Package: QFN; Pins: 20; Temperature: Commercial
LT8310EFE#PBF Linear Technology LT8310 - 100VIN Forward Converter Controller; Package: TSSOP; Pins: 20; Temperature: E
LT8310MPFE#TRPBF Linear Technology LT8310 - 100VIN Forward Converter Controller; Package: TSSOP; Pins: 20; Temperature: MP
BYD47-20 's PackagesBYD47-20 's pdf datasheet
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BYD47-20 Pinout, Pinouts
BYD47-20 pinout,Pin out
This is one package pinout of BYD47-20,If you need more pinouts please download BYD47-20's pdf datasheet.

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