HiPerDYN™ FRED For High Switching Frequencies

HiPerDYN FRED for high switching frequencies DSEP2X25-12C By IXYS Corporation
Part Manufacturer Description Datasheet Samples
24LC128-I/WF Microchip Technology Inc 128K 12C SERIAL EEPROM
24LC16SC/WF15K Microchip Technology Inc 16K,12C SMART CARD EE WAFER ON FRAME, 0C to +70C, Wafer-Frame, WFRAME
24LC128T-I/BG Microchip Technology Inc 128K 12C SERIAL EEPROM, -40C to +85C, 8-, DT/R
24LC16SC/S15K Microchip Technology Inc 16K,12C SMART CARD EE DIE IN WAFFLE PACK, 0C to +70C, Die-Waffle, WPAC
24LC16SC/W15K Microchip Technology Inc 16K,12C SMART CARD EE WAFER, 0C to +70C, Uncut Wafer, WJAR
24LC256/WF15K Microchip Technology Inc 256K 12C SERIAL EEPROM ON 150K DLM PROCESS., 0C to +70C, Wafer-Frame, WFRAME
24LC256/W15K Microchip Technology Inc 256K 12C SERIAL EEPROM ON 150K DLM PROCESS, 0C to +70C, Uncut Wafer, WJAR
DSEP2X25-12C 's PackagesDSEP2X25-12C 's pdf datasheet



DSEP2X25-12C Pinout, Pinouts
DSEP2X25-12C pinout,Pin out
This is one package pinout of DSEP2X25-12C,If you need more pinouts please download DSEP2X25-12C's pdf datasheet.

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DSEP2X25-12C Application Notes DSEP2X25-12C RoHS DSEP2X25-12C Circuits DSEP2X25-12C footprint