0.4 Mm Contact Pitch, 1.2 Mm Above The Board, Flexible Printed Circuit ZIF Connectors■Overview
Continuous miniaturization of personal mobile devices
created a need for a low profile, high density interconnection
system.In the same time, the demand for higher currents and
higher reliability Flexible Printed Circuits has also increased.
Hirose meets all these challenges with introduction of this connector.
■Features
1. Low profile, small PCB mounting area, weight reduction
Protruding only 1.2 mm above the board the connector
occupies 50% less area than comparable type having
contacts spaced on 0.5 mm centers.
Creative design, coupled with high manufacturing capabilities
resulted in extremely low weight of the connector.
2. Higher current carrying capacity
Contact spacing of 0.4 mm allows production of wider
and simpler pattern of conductive traces on FPC.
3. FPC temporary hold and verification of correct insertion
The connector has built-in FPC hold protrusions allowing
the tactile feel of the correct FPC insertion and holding it
in position before closing of the actuator. By Hirose Electric
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FH27-60S-0.4SH Pb-Free | FH27-60S-0.4SH Cross Reference | FH27-60S-0.4SH Schematic | FH27-60S-0.4SH Distributor |
FH27-60S-0.4SH Application Notes | FH27-60S-0.4SH RoHS | FH27-60S-0.4SH Circuits | FH27-60S-0.4SH footprint |