0.4 Mm Contact Pitch, 1.2 Mm Above The Board, Flexible Printed Circuit ZIF Connectors

■Overview Continuous miniaturization of personal mobile devices created a need for a low profile, high density interconnection system.In the same time, the demand for higher currents and higher reliability Flexible Printed Circuits has also increased. Hirose meets all these challenges with introduction of this connector. ■Features 1. Low profile, small PCB mounting area, weight reduction Protruding only 1.2 mm above the board the connector occupies 50% less area than comparable type having contacts spaced on 0.5 mm centers. Creative design, coupled with high manufacturing capabilities resulted in extremely low weight of the connector. 2. Higher current carrying capacity Contact spacing of 0.4 mm allows production of wider and simpler pattern of conductive traces on FPC. 3. FPC temporary hold and verification of correct insertion The connector has built-in FPC hold protrusions allowing the tactile feel of the correct FPC insertion and holding it in position before closing of the actuator. By Hirose Electric