100 V/2 A Peak High-Frequency Half Bridge Driver With CMOS Logic Inputs

The HIP2100 is a high frequency, 100V Half Bridge N-Channel Power MOSFET driver IC. The low-side and high-side Gate drivers are independently controlled and matched to 8ns. This gives the user maximum flexibility in dead-time selection and driver protocol. Undervoltage protection on both the low-side and high-side supplies force the outputs low. An on-chip Diode eliminates the Discrete Diode required with other driver ICs. A new level-shifter topology yields the low-power benefits of pulsed operation with the safety of DC operation. Unlike some competitors, the high-side output returns to its correct state after a momentary undervoltage of the high-side supply.
By Intersil Corporation
Part Manufacturer Description Datasheet Samples
HIP2100IRZ Renesas Electronics Corporation
  • Drives N-Channel MOSFET Half Bridge
  • SOIC, EPSOIC, and QFN Package Options
  • SOIC and EPSOIC Packages Compliant with 100V Conductor Spacing Guidelines of IPC-2221
  • Pb-Free (RoHS Compliant)
  • Bootstrap Supply Max Voltage to 114VDC
  • On-Chip 1Ω Bootstrap Diode
  • Fast Propagation Times for Multi-MHz Circuits
  • Drives 1000pF Load with Rise and Fall Times Typ 10ns
  • CMOS Input Thresholds for Improved Noise Immunity
  • Independent Inputs for Non-Half Bridge Topologies
  • No Start-Up Problems
  • Outputs Unaffected by Supply Glitches, HS Ringing Below Ground, or HS Slewing at High dv/dt
  • Low Power Consumption
  • Wide Supply Range
  • Supply Undervoltage Protection
  • 3Ω Driver Output Resistance
  • QFN Package:
    • Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline
    • Near Chip Scale Package Footprint, which Improves PCB Efficiency and has a Thinner Profile
  •  

     

    APPLICATIONS

  • Telecom Half Bridge Power Supplies
  • Avionics DC/DC Converters
  • Two-Switch Forward Converters
  • Active Clamp Forward Converters
  • HIP2100EVAL2 Renesas Electronics Corporation 100V/2A Peak High-Frequency Half Bridge Driver with CMOS Logic Inputs
    HIP2100IBZT Renesas Electronics Corporation
  • Drives N-Channel MOSFET Half Bridge
  • SOIC, EPSOIC, and QFN Package Options
  • SOIC and EPSOIC Packages Compliant with 100V Conductor Spacing Guidelines of IPC-2221
  • Pb-Free (RoHS Compliant)
  • Bootstrap Supply Max Voltage to 114VDC
  • On-Chip 1Ω Bootstrap Diode
  • Fast Propagation Times for Multi-MHz Circuits
  • Drives 1000pF Load with Rise and Fall Times Typ 10ns
  • CMOS Input Thresholds for Improved Noise Immunity
  • Independent Inputs for Non-Half Bridge Topologies
  • No Start-Up Problems
  • Outputs Unaffected by Supply Glitches, HS Ringing Below Ground, or HS Slewing at High dv/dt
  • Low Power Consumption
  • Wide Supply Range
  • Supply Undervoltage Protection
  • 3Ω Driver Output Resistance
  • QFN Package:
    • Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline
    • Near Chip Scale Package Footprint, which Improves PCB Efficiency and has a Thinner Profile
  •  

     

    APPLICATIONS

  • Telecom Half Bridge Power Supplies
  • Avionics DC/DC Converters
  • Two-Switch Forward Converters
  • Active Clamp Forward Converters
  • HIP2100IRZT Renesas Electronics Corporation
  • Drives N-Channel MOSFET Half Bridge
  • SOIC, EPSOIC, and QFN Package Options
  • SOIC and EPSOIC Packages Compliant with 100V Conductor Spacing Guidelines of IPC-2221
  • Pb-Free (RoHS Compliant)
  • Bootstrap Supply Max Voltage to 114VDC
  • On-Chip 1Ω Bootstrap Diode
  • Fast Propagation Times for Multi-MHz Circuits
  • Drives 1000pF Load with Rise and Fall Times Typ 10ns
  • CMOS Input Thresholds for Improved Noise Immunity
  • Independent Inputs for Non-Half Bridge Topologies
  • No Start-Up Problems
  • Outputs Unaffected by Supply Glitches, HS Ringing Below Ground, or HS Slewing at High dv/dt
  • Low Power Consumption
  • Wide Supply Range
  • Supply Undervoltage Protection
  • 3Ω Driver Output Resistance
  • QFN Package:
    • Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline
    • Near Chip Scale Package Footprint, which Improves PCB Efficiency and has a Thinner Profile
  •  

     

    APPLICATIONS

  • Telecom Half Bridge Power Supplies
  • Avionics DC/DC Converters
  • Two-Switch Forward Converters
  • Active Clamp Forward Converters
  • HIP2100EIBZT Renesas Electronics Corporation
  • Drives N-Channel MOSFET Half Bridge
  • SOIC, EPSOIC, and QFN Package Options
  • SOIC and EPSOIC Packages Compliant with 100V Conductor Spacing Guidelines of IPC-2221
  • Pb-Free (RoHS Compliant)
  • Bootstrap Supply Max Voltage to 114VDC
  • On-Chip 1Ω Bootstrap Diode
  • Fast Propagation Times for Multi-MHz Circuits
  • Drives 1000pF Load with Rise and Fall Times Typ 10ns
  • CMOS Input Thresholds for Improved Noise Immunity
  • Independent Inputs for Non-Half Bridge Topologies
  • No Start-Up Problems
  • Outputs Unaffected by Supply Glitches, HS Ringing Below Ground, or HS Slewing at High dv/dt
  • Low Power Consumption
  • Wide Supply Range
  • Supply Undervoltage Protection
  • 3Ω Driver Output Resistance
  • QFN Package:
    • Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline
    • Near Chip Scale Package Footprint, which Improves PCB Efficiency and has a Thinner Profile
  •  

     

    APPLICATIONS

  • Telecom Half Bridge Power Supplies
  • Avionics DC/DC Converters
  • Two-Switch Forward Converters
  • Active Clamp Forward Converters
  • HIP2100IBZ Renesas Electronics Corporation
  • Drives N-Channel MOSFET Half Bridge
  • SOIC, EPSOIC, and QFN Package Options
  • SOIC and EPSOIC Packages Compliant with 100V Conductor Spacing Guidelines of IPC-2221
  • Pb-Free (RoHS Compliant)
  • Bootstrap Supply Max Voltage to 114VDC
  • On-Chip 1Ω Bootstrap Diode
  • Fast Propagation Times for Multi-MHz Circuits
  • Drives 1000pF Load with Rise and Fall Times Typ 10ns
  • CMOS Input Thresholds for Improved Noise Immunity
  • Independent Inputs for Non-Half Bridge Topologies
  • No Start-Up Problems
  • Outputs Unaffected by Supply Glitches, HS Ringing Below Ground, or HS Slewing at High dv/dt
  • Low Power Consumption
  • Wide Supply Range
  • Supply Undervoltage Protection
  • 3Ω Driver Output Resistance
  • QFN Package:
    • Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline
    • Near Chip Scale Package Footprint, which Improves PCB Efficiency and has a Thinner Profile
  •  

     

    APPLICATIONS

  • Telecom Half Bridge Power Supplies
  • Avionics DC/DC Converters
  • Two-Switch Forward Converters
  • Active Clamp Forward Converters
  • HIP2100IBZT7A Renesas Electronics Corporation
  • Drives N-Channel MOSFET Half Bridge
  • SOIC, EPSOIC, and QFN Package Options
  • SOIC and EPSOIC Packages Compliant with 100V Conductor Spacing Guidelines of IPC-2221
  • Pb-Free (RoHS Compliant)
  • Bootstrap Supply Max Voltage to 114VDC
  • On-Chip 1Ω Bootstrap Diode
  • Fast Propagation Times for Multi-MHz Circuits
  • Drives 1000pF Load with Rise and Fall Times Typ 10ns
  • CMOS Input Thresholds for Improved Noise Immunity
  • Independent Inputs for Non-Half Bridge Topologies
  • No Start-Up Problems
  • Outputs Unaffected by Supply Glitches, HS Ringing Below Ground, or HS Slewing at High dv/dt
  • Low Power Consumption
  • Wide Supply Range
  • Supply Undervoltage Protection
  • 3Ω Driver Output Resistance
  • QFN Package:
    • Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline
    • Near Chip Scale Package Footprint, which Improves PCB Efficiency and has a Thinner Profile
  •  

     

    APPLICATIONS

  • Telecom Half Bridge Power Supplies
  • Avionics DC/DC Converters
  • Two-Switch Forward Converters
  • Active Clamp Forward Converters
  • HIP2100EIBZ Renesas Electronics Corporation
  • Drives N-Channel MOSFET Half Bridge
  • SOIC, EPSOIC, and QFN Package Options
  • SOIC and EPSOIC Packages Compliant with 100V Conductor Spacing Guidelines of IPC-2221
  • Pb-Free (RoHS Compliant)
  • Bootstrap Supply Max Voltage to 114VDC
  • On-Chip 1Ω Bootstrap Diode
  • Fast Propagation Times for Multi-MHz Circuits
  • Drives 1000pF Load with Rise and Fall Times Typ 10ns
  • CMOS Input Thresholds for Improved Noise Immunity
  • Independent Inputs for Non-Half Bridge Topologies
  • No Start-Up Problems
  • Outputs Unaffected by Supply Glitches, HS Ringing Below Ground, or HS Slewing at High dv/dt
  • Low Power Consumption
  • Wide Supply Range
  • Supply Undervoltage Protection
  • 3Ω Driver Output Resistance
  • QFN Package:
    • Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline
    • Near Chip Scale Package Footprint, which Improves PCB Efficiency and has a Thinner Profile
  •  

     

    APPLICATIONS

  • Telecom Half Bridge Power Supplies
  • Avionics DC/DC Converters
  • Two-Switch Forward Converters
  • Active Clamp Forward Converters
  • HIP2100 's PackagesHIP2100 's pdf datasheet
    HIP2100EIB SOIC
    HIP2100EIBT SOIC
    HIP2100EIBZ SOIC
    HIP2100EIBZT SOIC
    HIP2100IB SOIC
    HIP2100IBT SOIC
    HIP2100IBZ SOIC
    HIP2100IBZT SOIC
    HIP2100IR QFN
    HIP2100IR4 DFN
    HIP2100IR4T DFN
    HIP2100IR4Z DFN
    HIP2100IR4ZT DFN
    HIP2100IRT QFN
    HIP2100IRZ QFN
    HIP2100IRZT QFN




    HIP2100 Pinout, Pinouts
    HIP2100 pinout,Pin out
    This is one package pinout of HIP2100,If you need more pinouts please download HIP2100's pdf datasheet.

    HIP2100 Application circuits
    HIP2100 circuits
    This is one application circuit of HIP2100,If you need more circuits,please download HIP2100's pdf datasheet.


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    Related Keywords:

    HIP2100 Pb-Free HIP2100 Cross Reference HIP2100 Schematic HIP2100 Distributor
    HIP2100 Application Notes HIP2100 RoHS HIP2100 Circuits HIP2100 footprint