0.25mm Blue Leadframe-Based Surface Mount ChipLED

The HSMR-CL25 series of parts is designed with an ultra small form factor to allow this miniaturization. The HSMR- CL25 series is the thinnest available top emitting package in the market with high brightness InGaN die technology. The leadframe construction of this package allows the part to transfer heat from the package, thus it is able to survive temperature conditions of -40°C to 85°C despite its small size. The target applications are Keypad backlighting, Push button backlighting and Status indicators. The target markets are Mobile Handsets, Communications Ofce Automation, Industrial and Commercial automations, Home Market appliances, Networking, Medical Instruments, and Mobile Computing. This product is competitively priced, and production is geared towards short lead times and ample capacity. By Avago Technologies
Part Manufacturer Description Datasheet Samples
CL25N8-G Microchip Technology Inc LED DISPLAY DRIVER, PSSO3
CL25N3-G Microchip Technology Inc LED DISPLAY DRIVER, BCY3
HSMR-CL25 's PackagesHSMR-CL25 's pdf datasheet



HSMR-CL25 Pinout will be updated soon..., now you can download the pdf datasheet to check the pinouts !
HSMR-CL25 circuits will be updated soon..., now you can download the pdf datasheet to check the circuits!

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HSMR-CL25 Pb-Free HSMR-CL25 Cross Reference HSMR-CL25 Schematic HSMR-CL25 Distributor
HSMR-CL25 Application Notes HSMR-CL25 RoHS HSMR-CL25 Circuits HSMR-CL25 footprint
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