0.25mm White Leadframe-Based Surface Mount ChipLED

The HSMW-CL25 series of parts is designed with an ultra small form factor to allow this miniaturization. The HSMW- CL25 series is the thinnest available top emitting package in the market with high brightness InGaN die technology. The leadframe construction of this package allows the part to transfer heat from the package, thus it is able to survive temperature conditions of -40°C to 85°C despite its small size. By Avago Technologies
Part Manufacturer Description Datasheet Samples
CL25N8-G Microchip Technology Inc LED DISPLAY DRIVER, PSSO3
CL25N3-G Microchip Technology Inc LED DISPLAY DRIVER, BCY3
HSMW-CL25 's PackagesHSMW-CL25 's pdf datasheet



HSMW-CL25 Pinout will be updated soon..., now you can download the pdf datasheet to check the pinouts !
HSMW-CL25 circuits will be updated soon..., now you can download the pdf datasheet to check the circuits!

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HSMW-CL25 Application Notes HSMW-CL25 RoHS HSMW-CL25 Circuits HSMW-CL25 footprint
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