A IRF6714M With Standard Packaging

A IRF6714M with Standard Packaging IRF6714M TM The IRF6714MPbF combines the latest HEXFET, Power MOSFET Silicon technology with the advanced DirectFET packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.6 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%. By International Rectifier Corp.
IRF6714M 's PackagesIRF6714M 's pdf datasheet
IRF6714MTR1PBF
IRF6714MTRPBF




IRF6714M Pinout will be updated soon..., now you can download the pdf datasheet to check the pinouts !
IRF6714M circuits will be updated soon..., now you can download the pdf datasheet to check the circuits!

Related Electronics Part Number

Related Keywords:

IRF6714M Pb-Free IRF6714M Cross Reference IRF6714M Schematic IRF6714M Distributor
IRF6714M Application Notes IRF6714M RoHS IRF6714M Circuits IRF6714M footprint