IRF6715M The IRF6715MPbF combines the latest HEXFET, Power MOSFET Silicon technology with the advanced DirectFET packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.6 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%. By International Rectifier Corp.
IRF6715M 's PackagesIRF6715M 's pdf datasheet

IRF6715M Pinout, Pinouts
IRF6715M pinout,Pin out
This is one package pinout of IRF6715M,If you need more pinouts please download IRF6715M's pdf datasheet.

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