Direct FETPower MOSFET

The IRF6722MPbF combines the latest HEXFET, Power MOSFET Silicon technology with the advanced DirectFET packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET pack- age allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%. By International Rectifier Corp.
IRF6722M 's PackagesIRF6722M 's pdf datasheet
IRF6722MTR1PBF
IRF6722MTRPBF




IRF6722M Pinout will be updated soon..., now you can download the pdf datasheet to check the pinouts !
IRF6722M circuits will be updated soon..., now you can download the pdf datasheet to check the circuits!

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