Hexfet Power Mosfet - International Rectifier

Third Generation HEXFETs IRFZ24L from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on- resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and CAN dissipate up to 2.0W in a typical surface mount application. The through-hole version IRFZ24L is available for low- profile applications. By International Rectifier Corp.
IRFZ24L 's PackagesIRFZ24L 's pdf datasheet

IRFZ24L Pinout, Pinouts
IRFZ24L pinout,Pin out
This is one package pinout of IRFZ24L,If you need more pinouts please download IRFZ24L's pdf datasheet.

IRFZ24L Application circuits
IRFZ24L circuits
This is one application circuit of IRFZ24L,If you need more circuits,please download IRFZ24L's pdf datasheet.

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