ADD-A-pak GEN V Power Modules THYRISTOR/ THYRISTOR

The Generation V of Add-A-pak module IRKV105 combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior me- chanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of sur- face roughness and improve thermal spread. The Generation V of AAP module is manufactured without hard mold, eliminating in this way any possible direct stress on the leads. By International Rectifier Corp.
IRKV105 's PackagesIRKV105 's pdf datasheet



IRKV105 Pinout, Pinouts
IRKV105 pinout,Pin out
This is one package pinout of IRKV105,If you need more pinouts please download IRKV105's pdf datasheet.

IRKV105 circuits will be updated soon..., now you can download the pdf datasheet to check the circuits!

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