The Generation V of Add-A-pak module IRKV105 combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior me- chanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of sur- face roughness and improve thermal spread. The Generation V of AAP module is manufactured without hard mold, eliminating in this way any possible direct stress on the leads. By International Rectifier Corp.
IRKV105 's PackagesIRKV105 's pdf datasheet

IRKV105 Pinout, Pinouts
IRKV105 pinout,Pin out
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