HEXFET® Power MOSFET

The SOT-223 package is designed for surface-mount using vapor phase, infra red, or wave soldering techniques. Its unique package design allows for easy Automatic pick-and- place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. Power dissipation of grreater than 1.25W is possible in a typical surface mount application. By International Rectifier Corp.
IRLL110PBF 's PackagesIRLL110PBF 's pdf datasheet



IRLL110PBF Pinout, Pinouts
IRLL110PBF pinout,Pin out
This is one package pinout of IRLL110PBF,If you need more pinouts please download IRLL110PBF's pdf datasheet.

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