Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications. The D-PAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through- hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications. By International Rectifier Corp.
IRLU3103PBF 's PackagesIRLU3103PBF 's pdf datasheet

IRLU3103PBF Pinout, Pinouts
IRLU3103PBF pinout,Pin out
This is one package pinout of IRLU3103PBF,If you need more pinouts please download IRLU3103PBF's pdf datasheet.

IRLU3103PBF Application circuits
IRLU3103PBF circuits
This is one application circuit of IRLU3103PBF,If you need more circuits,please download IRLU3103PBF's pdf datasheet.

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