DDP 4Gb B-die DDR3 SDRAM Specification

The DDP 4Gb DDR3 SDRAM B-die is organized as a 128Mbit x 4 I/Os x 8banks, 64Mbit x 8 I/Os x 8banks. This synchronous device achieves high speed double-data-rate transfer rates of up to 1333Mb/sec/pin (DDR3- 1333) for general applications. The chip is designed to comply with the following key DDR3 SDRAM fea- tures such as posted CAS, Programmable CWL, Internal (Self) Calibra- tion, On Die Termination using ODT pin and Asynchronous Reset . By Samsung Semiconductor, Inc.