NAND Flash And Mobile LPDRAM 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP™)

Micron package-on-package (PoP) MCP products combine NAND Flash and Mobile LPDRAM devices in a single MCP. These products target mobile applications with low- power, high-performance, and minimal package-footprint design requirements. The NAND Flash and Mobile LPDRAM devices are also members of the Micron Discrete mem- ory products portfolio. The NAND Flash and Mobile LPDRAM devices are packaged with separate Interfaces (no shared address, control, data, or power balls). This bus architecture supports an op- timized Interface to processors with separate NAND Flash and Mobile LPDRAM buses. The NAND Flash and Mobile LPDRAM devices have separate core power connections and share a common ground (that is, Vss is tied together on the two devices). The bus architecture of this device also supports separate NAND Flash and Mobile LPDRAM functionality without concern for device interaction. Operational characteris- tics for the NAND Flash and Mobile LPDRAM devices are found in the standard Micron data sheets for each of the Discrete devices. By Micron Semiconductor Products
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MT29C2G24MAKLAJG-6IT Pinout, Pinouts
MT29C2G24MAKLAJG-6IT pinout,Pin out
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