The D2PAK package has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS(on) capabilities. This advanced TMOS EFET is designed to withstand high energy in the avalanche and commutation modes. The new energy efficient By Freescale Semiconductor, Inc
MTB36N06E 's PackagesMTB36N06E 's pdf datasheet

MTB36N06E Pinout, Pinouts
MTB36N06E pinout,Pin out
This is one package pinout of MTB36N06E,If you need more pinouts please download MTB36N06E's pdf datasheet.

MTB36N06E Application circuits
MTB36N06E circuits
This is one application circuit of MTB36N06E,If you need more circuits,please download MTB36N06E's pdf datasheet.

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