The D2PAK package has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS(on) capabilities. This high voltage MOSFET uses an advanced termination scheme to provide enhanced voltageblocking capability without degrading perfor- mance over time. In addition, this advanced By Freescale Semiconductor, Inc
MTB3N120E 's PackagesMTB3N120E 's pdf datasheet

MTB3N120E Pinout, Pinouts
MTB3N120E pinout,Pin out
This is one package pinout of MTB3N120E,If you need more pinouts please download MTB3N120E's pdf datasheet.

MTB3N120E Application circuits
MTB3N120E circuits
This is one application circuit of MTB3N120E,If you need more circuits,please download MTB3N120E's pdf datasheet.

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