Tmos Power Fet 25 Amperes 500 Volts Rds(on) = 0.200 Ohm , Inc

The D3PAK package MTV25N50E has the capability of housing the largest chip size of any standard, plastic, surface mount power semiconductor. This allows it to be used in applications that require surface mount components with higher power and lower RDS(on) capabilities. This high voltage MOSFET uses an advanced termination scheme to provide enhanced voltageblocking capability without degrading performance over time. In addition, this advanced TMOS EFET is designed to withstand high energy in the avalanche and commuta- tion modes. The new energy efficient design also offers a drainto source Diode with a fast recovery time. By Freescale Semiconductor, Inc
MTV25N50E 's PackagesMTV25N50E 's pdf datasheet

MTV25N50E Pinout, Pinouts
MTV25N50E pinout,Pin out
This is one package pinout of MTV25N50E,If you need more pinouts please download MTV25N50E's pdf datasheet.

MTV25N50E Application circuits
MTV25N50E circuits
This is one application circuit of MTV25N50E,If you need more circuits,please download MTV25N50E's pdf datasheet.

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