Intellimod™ Module Dual-in-line Intelligent Power Module (20 Amperes/600 Volts) Power Semiconductors

DIP and mini-DIP IPMs are intelligent Power Modules that integrate power devices, drivers, and protection circuitry in an ultra compact dual-in-line transfer-mold package for use in driving small three phase motors. Use of 4th generation IGBTs DIP packaging, and application specific HVICs allow the designer to reduce inverter size and overall design time. By Powerex, Inc.
Part Manufacturer Description Datasheet Samples
DSPIC33FJ128GP306AT-I/MR Microchip Technology Inc IC DSPIC MCU/DSP 128K 64-QFN
DSPIC33FJ64MC510A-E/PF Microchip Technology Inc IC DSPIC MCU/DSP 64K 100-TQFP
DSPIC33FJ64GP706A-I/PT Microchip Technology Inc IC DSPIC MCU/DSP 64K 64-TQFP
24AA1026-I/P Microchip Technology Inc 128K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
24FC128T-I/MNY Microchip Technology Inc 16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3 X 2 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8
25LC128XT-E/ST Microchip Technology Inc 16K X 8 SPI BUS SERIAL EEPROM, PDSO8, 4.40 MM, PLASTIC, TSSOP-8
24AA128/SN Microchip Technology Inc 16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOIC-8
24LC128T-E/MNY Microchip Technology Inc 16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3 X 2 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8
24LC174-I/P Microchip Technology Inc 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8
24LC164/SN Microchip Technology Inc 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8
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