Stacked Multi-Chip Product (MCP) 256 Megabit (32M/16M X 16-bit) CMOS 1.8 Volt-only, Simultaneous Read/Write, Burst Mode Flash Memory With 256/128 Megabit (4M/2M X 16-bit X 4 Banks) Mobile SDRAM On Shared Address/Data Bus

The S73WS series is a product line of stacked Multi-Chip Product (MCP) packages and consists of: One or two (in this case, one die is used as code and the other as data) Flash memory die, one Mobile SDRAM die, and shared address/data bus for Flash and Mobile SDRAM: 96-ball pinout.
By Meet Spansion Inc.
S73WS256N 's PackagesS73WS256N 's pdf datasheet



S73WS256N Pinout will be updated soon..., now you can download the pdf datasheet to check the pinouts !
S73WS256N circuits will be updated soon..., now you can download the pdf datasheet to check the circuits!

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