Avalanche Photodiode SSO-AD-230-TO52-S1

Avalanche Photodiode SSO-AD-230-TO52-S1 By Roithner LaserTechnik GmbH
Part Manufacturer Description Datasheet Samples
SG-BGA-7008 Ironwood Electronics BGA Socket; Lid Type : Swivel; Interconnect/Media : Elastomer; Pitch mm : 0.4 to 0.75; Socket Speed (GHz): 10; Operating Temperature: -35 to 100 C; Insertions: 1700
PC-SOIC/DIP24-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SOJ24A_SOJ24B_SOJ24C_SOJ24D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 24; Bottom Pin Count: 24; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.167 - 0.367; Adapter Size Length X Width (in.): 1.2 x 0.4; Part Description: SOIC to DIP Converter;
PC-SOIC/DIP8-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO8A_S08B_SO8E; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 8; Bottom Pin Count: 8; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.15 - 0.375; Adapter Size Length X Width (in.): 0.4 x 0.4; Part Description: SOIC to DIP Converter;
PC-SOIC/DIP20-04 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO20A_SO20B_SO20D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 20; Bottom Pin Count: 20; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.275 - 0.475; Adapter Size Length X Width (in.): 1 x 0.4; Part Description: SOIC to DIP Converter;
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SSO-AD-230-TO52-S1 's PackagesSSO-AD-230-TO52-S1 's pdf datasheet
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SSO-AD-230-TO52-S1 Pinout, Pinouts
SSO-AD-230-TO52-S1 pinout,Pin out
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