6.5 Watt Ku Band Power Amplifier

The TGA2514-FL provides 24 dB of gain and 6.5W of output power across 13-16 GHz. The TGA2514-FL is designed using TriQuints proven standard 0.25-, Gate pHEMT production process. This device is ideally suited for VSAT Transmitter and Point to Point Radio applications. The flange lead package has a high thermal conductivity copper alloy base. By TriQuint Semiconductor
Part Manufacturer Description Datasheet Samples
PL-PLCC68-S-01 Ironwood Electronics PLCC Plug-in Adapters; Part Description: PLCC Plug Surface Mount; Top Pin Count: 68; Bottom Pin Count: 68;
SG-BGA-7008 Ironwood Electronics BGA Socket; Lid Type : Swivel; Interconnect/Media : Elastomer; Pitch mm : 0.4 to 0.75; Socket Speed (GHz): 10; Operating Temperature: -35 to 100 C; Insertions: 1700
PL-PLCC52-S-01 Ironwood Electronics PLCC Plug-in Adapters; Part Description: PLCC Plug Surface Mount; Top Pin Count: 52; Bottom Pin Count: 52;
SBT-QFN-4000 Ironwood Electronics Spring Pin (Pogo) Socket, QFN, 16pin
PC-SOIC/DIP24-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SOJ24A_SOJ24B_SOJ24C_SOJ24D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 24; Bottom Pin Count: 24; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.167 - 0.367; Adapter Size Length X Width (in.): 1.2 x 0.4; Part Description: SOIC to DIP Converter;
PC-SOIC/DIP8-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO8A_S08B_SO8E; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 8; Bottom Pin Count: 8; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.15 - 0.375; Adapter Size Length X Width (in.): 0.4 x 0.4; Part Description: SOIC to DIP Converter;
PC-SOIC/DIP20-04 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO20A_SO20B_SO20D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 20; Bottom Pin Count: 20; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.275 - 0.475; Adapter Size Length X Width (in.): 1 x 0.4; Part Description: SOIC to DIP Converter;
CWA-MPC-5XX-LX Freescale Semiconductor ANNUAL SUBSCR: MPC5XX FL
CWS-H08-C32K-LX Freescale Semiconductor CW SW+SPT:HCS08 32K C FL
CWS-H08-C64K-LX Freescale Semiconductor CW SW+SPT:HCS08 64K C FL
TGA2514-FL 's PackagesTGA2514-FL 's pdf datasheet
TGA2514-FL pdf datasheet download


TGA2514-FL Pinout will be updated soon..., now you can download the pdf datasheet to check the pinouts !
TGA2514-FL Application circuits
TGA2514-FL circuits
This is one application circuit of TGA2514-FL,If you need more circuits,please download TGA2514-FL's pdf datasheet.


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