Complete Single-chip Channelized DS3 Solution

TEPro is a RISC processor-based device that supports the requirements of next-generation channelized DS3 access systems. TEPro integrates an M13 multiplexer, G.747 Mux/De- Mux framer, 28 DS1 / 21 E1 framers, T1/E1 cross connect and a 672 x 4,096-channel DS0 cross connect with an embedded high-performance Microprocessor to provide a complete channelized DS3 solution on a single chip. The embedded processor firmware handles device drivers, data links, alarms, messaging, MIB performance objects, and signaling functions and allows Communication to an external host via high-level API messages. Embedded firmware is provided by TranSwitch and loaded from an external serial EEPROM at device boot-up. By TranSwitch Corporation
TXC-06830 's PackagesTXC-06830 's pdf datasheet



TXC-06830 Pinout will be updated soon..., now you can download the pdf datasheet to check the pinouts !
TXC-06830 circuits will be updated soon..., now you can download the pdf datasheet to check the circuits!

Related Electronics Part Number

Related Keywords:

TXC-06830 Pb-Free TXC-06830 Cross Reference TXC-06830 Schematic TXC-06830 Distributor
TXC-06830 Application Notes TXC-06830 RoHS TXC-06830 Circuits TXC-06830 footprint