What is DQFN package ? DQFN means The DQFN is a modifi ed HVQFN with some of the terminals depopulated to meet the specifi ed pad counts (currently 14, 16 and 20 pad confi gura- tions). The removal of the terminals reduced the DQFN’s body width from that of the HVQFN. Like the HVQFN, the DQFN is a leadless package where electrical contact is made by soldering the pads on the bottom surface of the package to the board, instead of the conventional formed perimeter leads. With the removal of the perimeter leads the footprint has decreased to near chip- scale size. When compared the DQFN-14 provides 76% space savings over TSSOP-14, and the DQFN-16 and 20 provide a 73% space savings over the TSSOP-16 and 20 respectively. The DQFN-24 provides a 61% space savings over a TSSOP-24.This is the smallest package in the industry for standard logic gate and octal functions. The exposed die paddle technology enhances the thermal and electrical qualities of the package. The die-attach paddle on the bottom effi ciently conducts heat to the board. Tests comparing the DQFN’s thermal performance with TSSOP’s show that the DQFN dissipates heat up to 20% more effi ciently. Also, with the contact surfaces beneath the package there is no risk of bent lead or co-planarity problems. Handling and packaging becomes easier as a result of this. And, like the VFBGA, the shorter wire length and shorter internal traces improve package performance by up to 20% over TSSOP. Package inductance is also reduced by 60% and capacitance by 30% over TSSOP. DQFN package image
