PDIP Package

PDIP Package

What is PDIP package?
 PDIP package means  dual in-line package (DIP)
In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins, protruding from the longer sides of the package and bent downward. A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14.
Several PDIPs and CERDIPS. The large CERDIP in the foreground is an 8080 processor.

DIPs may be used for integrated circuits (ICs, "chips"), like microprocessors, or for arrays of discrete components such as resistors or toggle switches. They can be mounted on a printed circuit board (PCB) either directly using through-hole technology, or using inexpensive sockets to allow for easy replacement of the device and to reduce the risk of overheat damage during soldering.
PDIP package image.
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Part Manufacturer Description Datasheet Samples
CY3250-S8PDIP-FK Cypress Semiconductor PDIP EVAL BOARD
CY3250-20PDIP-FK Cypress Semiconductor PSOC POD FEET FOR 20-DIP
CY3250-28PDIP-FK Cypress Semiconductor PSOC POD FEET FOR 28-DIP
CY3250-8PDIP-FK Cypress Semiconductor PSOC POD FEET FOR 8-DIP
DC1398A-GA Linear Technology BOARD EVAL LTM9001-GA
PC-SOIC/DIP20-04 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO20A_SO20B_SO20D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 20; Bottom Pin Count: 20; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.275 - 0.475; Adapter Size Length X Width (in.): 1 x 0.4; Part Description: SOIC to DIP Converter;
PC-SOIC/DIP8-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO8A_S08B_SO8E; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 8; Bottom Pin Count: 8; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.15 - 0.375; Adapter Size Length X Width (in.): 0.4 x 0.4; Part Description: SOIC to DIP Converter;
PC-SOIC/DIP24-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SOJ24A_SOJ24B_SOJ24C_SOJ24D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 24; Bottom Pin Count: 24; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.167 - 0.367; Adapter Size Length X Width (in.): 1.2 x 0.4; Part Description: SOIC to DIP Converter;
MAX121CPE-W Maxim Integrated Products 16 PINS PDIP PKG
MOC3010 Texas Instruments Optocoupler/Optoisolator 6-PDIP

Check the other IC package image