SSOP Package

SSOP Package

What is SSOP package?
SSOP package means Shrink Small-Outline Package .
Shrink small-outline package (SSOP) is a microchip package for surface-mount technology. SSOP chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm).
SSOP package picutre.
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46 pin SSOP package
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Part Manufacturer Description Datasheet Samples
DEM-OPA-SSOP-3B Texas Instruments FREE DEM-OPA-SSOP-3B
DEM-OPA-SSOP-3A Texas Instruments FREE DEM-OPA-SSOP-3A
DEM-OPA-SSOP-3D Texas Instruments FREE DEM-OPA-SSOP-3D
DEM-TIV-SSOP-3A Texas Instruments FREE DEM-TIV-SSOP-3A
DEM-OPA-SSOP-3E Texas Instruments FREE DEM-OPA-SSOP-3E
DEM-OPA-SSOP-3C Texas Instruments DEM-OPA-SSOP-3C Free Evaluation Tools
DEM-OPA-TSSOP-4A Texas Instruments FREE DEM-OPA-TSSOP-4A
PC-SOIC/DIP8-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO8A_S08B_SO8E; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 8; Bottom Pin Count: 8; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.15 - 0.375; Adapter Size Length X Width (in.): 0.4 x 0.4; Part Description: SOIC to DIP Converter;
PC-SOIC/DIP24-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SOJ24A_SOJ24B_SOJ24C_SOJ24D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 24; Bottom Pin Count: 24; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.167 - 0.367; Adapter Size Length X Width (in.): 1.2 x 0.4; Part Description: SOIC to DIP Converter;
PC-SOIC/DIP20-04 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO20A_SO20B_SO20D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 20; Bottom Pin Count: 20; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.275 - 0.475; Adapter Size Length X Width (in.): 1 x 0.4; Part Description: SOIC to DIP Converter;

Check the other IC package image