TO-220 Package

What is TO-220 package?
TO-220 package means TO220 Package.
The TO-220 is a style of electronic component package, commonly used for transistors, silicon-controlled rectifiers, and integrated circuits. TO-220 packages commonly have three leads although units with two, four, five or seven leads are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. Components made in TO-220 packages can handle more power than those constructed in TO-92 cases.
3 pin TO-220 package image

5 pin TO-220 package image

7 pin TO-220 package image

9 pin TO-220 package image

11 pin TO-220 package image

27 pin TO-220 package image

Part	Manufacturer	Description
Low-Dropout Fixed-Voltage Regulators 3-TO-220 0 to 125	Texas Instruments	TLV2217
SG-BGA-7008	Ironwood Electronics	BGA Socket; Lid Type : Swivel; Interconnect/Media : Elastomer; Pitch mm : 0.4 to 0.75; Socket Speed (GHz): 10; Operating Temperature: -35 to 100 C; Insertions: 1700
PC-SOIC/DIP24-01	Ironwood Electronics	SOIC to DIP Package Converters; Top Package Code: SOJ24A_SOJ24B_SOJ24C_SOJ24D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 24; Bottom Pin Count: 24; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.167 - 0.367; Adapter Size Length X Width (in.): 1.2 x 0.4; Part Description: SOIC to DIP Converter;
PC-SOIC/DIP20-04	Ironwood Electronics	SOIC to DIP Package Converters; Top Package Code: SO20A_SO20B_SO20D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 20; Bottom Pin Count: 20; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.275 - 0.475; Adapter Size Length X Width (in.): 1 x 0.4; Part Description: SOIC to DIP Converter;
PC-SOIC/DIP8-01	Ironwood Electronics	SOIC to DIP Package Converters; Top Package Code: SO8A_S08B_SO8E; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 8; Bottom Pin Count: 8; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.15 - 0.375; Adapter Size Length X Width (in.): 0.4 x 0.4; Part Description: SOIC to DIP Converter;
LTC2600CUFD#PBF	Linear Technology	IC SERIAL INPUT LOADING, 10 us SETTLING TIME, 16-BIT DAC, PQCC20, 4 X 5 MM, LEAD FREE, PLASTIC, MO-220, QFN-20, Digital to Analog Converter
LTC2600IUFD#TRPBF	Linear Technology	IC SERIAL INPUT LOADING, 10 us SETTLING TIME, 16-BIT DAC, PQCC20, 4 X 5 MM, LEAD FREE, PLASTIC, MO-220, QFN-20, Digital to Analog Converter
LTC2600CUFD#TRPBF	Linear Technology	IC SERIAL INPUT LOADING, 10 us SETTLING TIME, 16-BIT DAC, PQCC20, 4 X 5 MM, LEAD FREE, PLASTIC, MO-220, QFN-20, Digital to Analog Converter
LTC2600IUFD#PBF	Linear Technology	IC SERIAL INPUT LOADING, 10 us SETTLING TIME, 16-BIT DAC, PQCC20, 4 X 5 MM, LEAD FREE, PLASTIC, MO-220, QFN-20, Digital to Analog Converter
LTC2610CUFD#TRPBF	Linear Technology	IC SERIAL INPUT LOADING, 9 us SETTLING TIME, 14-BIT DAC, PQCC20, 4 X 5 MM, LEAD FREE, PLASTIC, MO-220, QFN-20, Digital to Analog Converter

TO-220 Package

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