TSOP Package

TSOP Package

What is TSOP package?
TSOP package means small-outline packages
Thin small-outline packages, or TSOPs are a type of surface mount IC package. They are notably very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).

They are frequently used for RAM or Flash memory ICs dues to their high pin count and small volume. However, they are being supplanted by ball grid array packages which can achieve even higher densities.
TSOP package picutre.
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Part Manufacturer Description Datasheet Samples
CY27C512-150ZC Rochester Electronics LLC OTP ROM, 64KX8, 150ns, CMOS, PDSO28, TSOP-28
TE28F800B5B90 Rochester Electronics LLC Flash, 1MX8, 90ns, PDSO48, 12 X 20 MM, TSOP-48
X28C512TM-12 Rochester Electronics LLC EEPROM, 64KX8, 120ns, Parallel, CMOS, PDSO40, TSOP-40
X28C512TI-12 Rochester Electronics LLC EEPROM, 64KX8, 120ns, Parallel, CMOS, PDSO40, TSOP-40
E28F008S3-150 Rochester Electronics LLC Flash, 1MX8, 150ns, PDSO40, 10 X 20 MM, TSOP-40
E28F008BV-B70 Rochester Electronics LLC Flash, 1MX8, 120ns, PDSO40, 10 X 20 MM, TSOP-40
TE28F008B3T120 Rochester Electronics LLC Flash, 1MX8, 120ns, PDSO40, 10 X 20 MM, TSOP-40
X28C512TI-90 Rochester Electronics LLC EEPROM, 64KX8, 90ns, Parallel, CMOS, PDSO40, TSOP-40
X28C512TM-90 Rochester Electronics LLC EEPROM, 64KX8, 90ns, Parallel, CMOS, PDSO40, TSOP-40
X28C512TM-25 Rochester Electronics LLC EEPROM, 64KX8, 250ns, Parallel, CMOS, PDSO40, TSOP-40

Check the other IC package image