TSOP Package

TSOP Package

What is TSOP package?
TSOP package means small-outline packages
Thin small-outline packages, or TSOPs are a type of surface mount IC package. They are notably very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).

They are frequently used for RAM or Flash memory ICs dues to their high pin count and small volume. However, they are being supplanted by ball grid array packages which can achieve even higher densities.
TSOP package picutre.
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Part Manufacturer Description Datasheet Samples
PC-SOIC/DIP24-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SOJ24A_SOJ24B_SOJ24C_SOJ24D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 24; Bottom Pin Count: 24; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.167 - 0.367; Adapter Size Length X Width (in.): 1.2 x 0.4; Part Description: SOIC to DIP Converter;
PC-SOIC/DIP20-04 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO20A_SO20B_SO20D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 20; Bottom Pin Count: 20; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.275 - 0.475; Adapter Size Length X Width (in.): 1 x 0.4; Part Description: SOIC to DIP Converter;
PC-SOIC/DIP8-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO8A_S08B_SO8E; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 8; Bottom Pin Count: 8; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.15 - 0.375; Adapter Size Length X Width (in.): 0.4 x 0.4; Part Description: SOIC to DIP Converter;
SBT-QFN-4000 Ironwood Electronics Spring Pin (Pogo) Socket, QFN, 16pin
SG-BGA-7008 Ironwood Electronics BGA Socket; Lid Type : Swivel; Interconnect/Media : Elastomer; Pitch mm : 0.4 to 0.75; Socket Speed (GHz): 10; Operating Temperature: -35 to 100 C; Insertions: 1700
DC1398A-GA Linear Technology BOARD EVAL LTM9001-GA
TL2218-285PW Texas Instruments Current-Mode SCSI Terminator 20-TSSOP
TL2218-285PWR Texas Instruments Current-Mode SCSI Terminator 20-TSSOP
TL2218-285PWRG4 Texas Instruments Current-Mode SCSI Terminator 20-TSSOP
TL2218-285PWG4 Texas Instruments Current-Mode SCSI Terminator 20-TSSOP

Check the other IC package image