TSOP Package

TSOP Package

What is TSOP package?
TSOP package means small-outline packages
Thin small-outline packages, or TSOPs are a type of surface mount IC package. They are notably very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).

They are frequently used for RAM or Flash memory ICs dues to their high pin count and small volume. However, they are being supplanted by ball grid array packages which can achieve even higher densities.
TSOP package picutre.
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Part Manufacturer Description Datasheet Samples
UCC5628FQP/81540 Texas Instruments 14 Line 2.7- 5V Multimode Terminator for SCSI through Ultra320 SCSI 48-LQFP
DC1398A-GA Linear Technology BOARD EVAL LTM9001-GA
PA78DK Apex Microtechnology Inc OP-AMP, 40000uV OFFSET-MAX, 1MHz BAND WIDTH, PDSO20, ROHS COMPLIANT, PLASTIC, SOP-20
PA79DK Apex Microtechnology Inc DUAL OP-AMP, 40000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO20, ROHS COMPLIANT, PLASTIC, SOP-20
PA16A Apex Microtechnology Inc OP-AMP, 3000uV OFFSET-MAX, 4.5MHz BAND WIDTH, PSFM12, POWER, SIP-12
PA16 Apex Microtechnology Inc OP-AMP, 10000uV OFFSET-MAX, 4.5MHz BAND WIDTH, PSFM12, POWER, SIP-12
PA107DP Apex Microtechnology Inc OP-AMP, 10000 uV OFFSET-MAX, 180 MHz BAND WIDTH, SFM12, ROHS COMPLIANT, SIP-12
PA98 Apex Microtechnology Inc OP-AMP, 2000uV OFFSET-MAX, 100MHz BAND WIDTH, PSFM12, POWER, SIP-12
PA98A Apex Microtechnology Inc OP-AMP, 500 uV OFFSET-MAX, 100 MHz BAND WIDTH, PSFM12, POWER, SIP-12
PA97DR Apex Microtechnology Inc OP-AMP, 50 uV OFFSET-MAX, 1 MHz BAND WIDTH, SIP7, ROHS COMPLIANT, SIP-7

Check the other IC package image